Substrate temperature calculation for pulsed bias arc ion plating
The main factors influencing substrate temperature such as ion bombardment, heat radiation, and heat conductivity are analyzed for Pulsed-Bias Arc Ion Plating (PBAIP). The wave profile of the pulsed bias voltage, varying from −1000 to 0 V, is basically rectangle. This characteristic periodic energy...
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Veröffentlicht in: | Surface & coatings technology 2005-05, Vol.194 (2), p.325-329 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The main factors influencing substrate temperature such as ion bombardment, heat radiation, and heat conductivity are analyzed for Pulsed-Bias Arc Ion Plating (PBAIP). The wave profile of the pulsed bias voltage, varying from −1000 to 0 V, is basically rectangle. This characteristic periodic energy input has an average energy density being equal to the product of that of the DC Arc Ion Plating (DCAIP) and the duty cycle in PBAIP. A temperature model based on energy conservation for the substrate temperature is thus established, which incorporates input ion power, heat radiation and heat conductivity. Experiments are also conducted to verify the calculation. |
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ISSN: | 0257-8972 1879-3347 |
DOI: | 10.1016/j.surfcoat.2004.07.074 |