IPVD deposition of titanium based thin films

Classical magnetron sputtering assisted with an additional ionization device, especially a radio-frequency coil, is a well-known technique to improve the deposited layer qualities. The aim of this work is to characterize the deposition of titanium based thin films either in the plasma or in the deposited layer. With a RF power of 500 W and a pressure of 5 Pa, we measured an ionization ratio of 20%. In this condition, the density of the film is higher, and the oxygen contamination is lower than with a PVD deposited film.