Determination of Mechanical Properties of Copper at the Micron Scale

Using a focused ion beam workstation, micron‐sized bending and compression samples were fabricated from a pure copper single crystal. The bending and compression experiments exhibited a strong size effect on the flow stress of copper, reaching values in the order of 1 GPa for the smallest test struc...

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Veröffentlicht in:Advanced engineering materials 2006-11, Vol.8 (11), p.1119-1125
Hauptverfasser: Kiener, D., Motz, C., Schöberl, T., Jenko, M., Dehm, G.
Format: Artikel
Sprache:eng
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Zusammenfassung:Using a focused ion beam workstation, micron‐sized bending and compression samples were fabricated from a pure copper single crystal. The bending and compression experiments exhibited a strong size effect on the flow stress of copper, reaching values in the order of 1 GPa for the smallest test structures. Conventional strain gradient plasticity approaches are not capable of explaining this behaviour. The surface damage introduced by Ga+ ion implantation during focused ion beam preparation was investigated using Auger electron spectroscopy and its consequence on the mechanical response of the miniaturized test samples is addressed.
ISSN:1438-1656
1527-2648
DOI:10.1002/adem.200600129