Preparation and dielectric properties of polyimide foams containing crosslinked structures

In order to obtain cellular materials with low dielectric properties, crosslinked polyimide foams were prepared using 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA), 4,4′‐oxydianiline (ODA) and 2,4,6‐triaminopyrimidine (TAP) as monomer via a poly(ester‐amine salt) precursor process. The structures of the precursors and the polyimide foams were characterized by thermogravimetric analysis (TGA) and FT‐IR, while the morphologies of the polyimide foams were viewed from scanning electron microscopy (SEM) measurements. The results revealed that the poly(ester‐amine salt) precursor containing TAP could successfully be converted to a crosslinked polyimide foam with relatively uniform cell structure. Also, the crosslinking of TAP improved the mechanical properties of foams in comparison with the non‐crosslinking systems. With increasing content of TAP, the dielectric constants of the polyimide foams decreased gradually. For the foam with TAP molar ratio at 15%, the dielectric constant was as low as 1.77 at the frequency of 10 kHz. Though the thermal resistance decreased slightly for crosslinked foams, the decomposition temperatures were still maintained above 520°C. Copyright © 2006 John Wiley & Sons, Ltd.