An engineering approach to predict the polishing rate in CMP with rotational equipment

In this paper we present an approach for predicting polishing rate with the main parameters in the recipe. Compared with Preston's equation, a dimensional analysis-based equation, RR = A X (DF/BP)1/2 X (TR/TT)b X TT, was given. We used a method called "dimensional analysis" to deduce an empirical equation. We successfully correlated the polishing rate with the operational parameters, such as the turntable rotational speed, the top-ring rotational speed, downforce, and back-side pressure. For the convenience of chemical mechanical polishing (CMP) process engineers, we proposed a simple method to help predict the polishing rate. With the experimental data, the presented equation seems workable.