Injection moulding of oxide reduced copper powders
Fine oxide reduced copper powders of about 10 μm mean grain size are irregular in particle shape and high in oxygen content, which poses a difficulty in achieving good properties from injection moulding. Injection moulding was possible when a multicomponent binder with a large fraction of the backbo...
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Veröffentlicht in: | Powder metallurgy 2005-06, Vol.48 (2), p.129-133 |
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description | Fine oxide reduced copper powders of about 10 μm mean grain size are irregular in particle shape and high in oxygen content, which poses a difficulty in achieving good properties from injection moulding. Injection moulding was possible when a multicomponent binder with a large fraction of the backbone polymer was used. Injection moulded parts could be sintered to a density of about 95% theoretical, if reduction of the residual oxides in the powder was effectively carried out prior to closure of pores during sintering. Under such a condition, the injection moulded parts could attain an electrical conductivity higher than 80% of pure copper. July 2004. |
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Injection moulding was possible when a multicomponent binder with a large fraction of the backbone polymer was used. Injection moulded parts could be sintered to a density of about 95% theoretical, if reduction of the residual oxides in the powder was effectively carried out prior to closure of pores during sintering. Under such a condition, the injection moulded parts could attain an electrical conductivity higher than 80% of pure copper. July 2004.</description><identifier>ISSN: 0032-5899</identifier><identifier>EISSN: 1743-2901</identifier><identifier>DOI: 10.1179/003258905X37710</identifier><identifier>CODEN: PWMTAU</identifier><language>eng</language><publisher>London, England: Taylor & Francis</publisher><subject>Applied sciences ; COPPER POWDER ; ELECTRICAL CONDUCTIVITY ; Exact sciences and technology ; INJECTION MOULDING ; Metals. Metallurgy ; OXIDE REDUCTION ; Powder metallurgy. Composite materials ; Production techniques ; Technology</subject><ispartof>Powder metallurgy, 2005-06, Vol.48 (2), p.129-133</ispartof><rights>2005 Maney Publishing 2005</rights><rights>2005 Maney Publishing</rights><rights>2006 INIST-CNRS</rights><rights>Copyright Institute of Materials Jun 2005</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c479t-e8e9b2eb1a509684f7be0cbf0521fd6606fbe268b939c5a075a04228c7ce29043</citedby><cites>FETCH-LOGICAL-c479t-e8e9b2eb1a509684f7be0cbf0521fd6606fbe268b939c5a075a04228c7ce29043</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://journals.sagepub.com/doi/pdf/10.1179/003258905X37710$$EPDF$$P50$$Gsage$$H</linktopdf><linktohtml>$$Uhttps://journals.sagepub.com/doi/10.1179/003258905X37710$$EHTML$$P50$$Gsage$$H</linktohtml><link.rule.ids>314,780,784,21819,27924,27925,43621,43622</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=16958582$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Chan, T.-Y.</creatorcontrib><creatorcontrib>Chuang, M.-S.</creatorcontrib><creatorcontrib>Lin, S.-T.</creatorcontrib><title>Injection moulding of oxide reduced copper powders</title><title>Powder metallurgy</title><description>Fine oxide reduced copper powders of about 10 μm mean grain size are irregular in particle shape and high in oxygen content, which poses a difficulty in achieving good properties from injection moulding. Injection moulding was possible when a multicomponent binder with a large fraction of the backbone polymer was used. Injection moulded parts could be sintered to a density of about 95% theoretical, if reduction of the residual oxides in the powder was effectively carried out prior to closure of pores during sintering. Under such a condition, the injection moulded parts could attain an electrical conductivity higher than 80% of pure copper. July 2004.</description><subject>Applied sciences</subject><subject>COPPER POWDER</subject><subject>ELECTRICAL CONDUCTIVITY</subject><subject>Exact sciences and technology</subject><subject>INJECTION MOULDING</subject><subject>Metals. Metallurgy</subject><subject>OXIDE REDUCTION</subject><subject>Powder metallurgy. Composite materials</subject><subject>Production techniques</subject><subject>Technology</subject><issn>0032-5899</issn><issn>1743-2901</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2005</creationdate><recordtype>article</recordtype><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNqNkc9LwzAUx4MoOKdnr0XQk3VJ2jSJNxn-GAy8KHgrafoyOtqmJitz_70ZnQyEoYfwCO_z_X7f4yF0SfAdIVxOME4oExKzj4Rzgo_QiPA0ianE5BiNtt04tOUpOvN-icOfCTFCdNYuQa8q20aN7euyaheRNZH9qkqIHJS9hjLStuvARZ1dl-D8OToxqvZwsatj9P70-DZ9ieevz7PpwzzWKZerGATIgkJBFMMyE6nhBWBdGMwoMWWW4cwUQDNRyERqpjAPL6VUaK4hDJ0mY3Qz-HbOfvbgV3lTeQ11rVqwvc-pTCnHUvwNigAlCf4HyDI8gFe_wKXtXRu2zWmIFYxkMkCTAdLOeu_A5J2rGuU2OcH59iT5r5MExfXOVnmtauNUqyu_l2WSCSZo4G4HzqsF7KMP294PeNUa6xq1tq4u85Xa1Nb9ZCSHxN9nv6h4</recordid><startdate>20050601</startdate><enddate>20050601</enddate><creator>Chan, T.-Y.</creator><creator>Chuang, M.-S.</creator><creator>Lin, S.-T.</creator><general>Taylor & Francis</general><general>SAGE Publications</general><general>Maney</general><general>Taylor & Francis Ltd</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope><scope>S0X</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>8BQ</scope><scope>H8G</scope><scope>JG9</scope><scope>7TB</scope></search><sort><creationdate>20050601</creationdate><title>Injection moulding of oxide reduced copper powders</title><author>Chan, T.-Y. ; Chuang, M.-S. ; Lin, S.-T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c479t-e8e9b2eb1a509684f7be0cbf0521fd6606fbe268b939c5a075a04228c7ce29043</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2005</creationdate><topic>Applied sciences</topic><topic>COPPER POWDER</topic><topic>ELECTRICAL CONDUCTIVITY</topic><topic>Exact sciences and technology</topic><topic>INJECTION MOULDING</topic><topic>Metals. Metallurgy</topic><topic>OXIDE REDUCTION</topic><topic>Powder metallurgy. Composite materials</topic><topic>Production techniques</topic><topic>Technology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chan, T.-Y.</creatorcontrib><creatorcontrib>Chuang, M.-S.</creatorcontrib><creatorcontrib>Lin, S.-T.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>METADEX</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><jtitle>Powder metallurgy</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chan, T.-Y.</au><au>Chuang, M.-S.</au><au>Lin, S.-T.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Injection moulding of oxide reduced copper powders</atitle><jtitle>Powder metallurgy</jtitle><date>2005-06-01</date><risdate>2005</risdate><volume>48</volume><issue>2</issue><spage>129</spage><epage>133</epage><pages>129-133</pages><issn>0032-5899</issn><eissn>1743-2901</eissn><coden>PWMTAU</coden><abstract>Fine oxide reduced copper powders of about 10 μm mean grain size are irregular in particle shape and high in oxygen content, which poses a difficulty in achieving good properties from injection moulding. Injection moulding was possible when a multicomponent binder with a large fraction of the backbone polymer was used. Injection moulded parts could be sintered to a density of about 95% theoretical, if reduction of the residual oxides in the powder was effectively carried out prior to closure of pores during sintering. Under such a condition, the injection moulded parts could attain an electrical conductivity higher than 80% of pure copper. July 2004.</abstract><cop>London, England</cop><pub>Taylor & Francis</pub><doi>10.1179/003258905X37710</doi><tpages>5</tpages></addata></record> |
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source | SAGE Complete A-Z List |
subjects | Applied sciences COPPER POWDER ELECTRICAL CONDUCTIVITY Exact sciences and technology INJECTION MOULDING Metals. Metallurgy OXIDE REDUCTION Powder metallurgy. Composite materials Production techniques Technology |
title | Injection moulding of oxide reduced copper powders |
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