Effect of preparation conditions on the thermal stability of an epoxy-functional inorganic–organic hybrid material system with phenyl side group

A hybrid material system consisting of (3-glycidyloxypropyl)trimethoxysilane and dimethyldimethoxysilane as matrix materials and diphenyldimethoxysilane (DPDMS) as both a matrix material and a potential thermal stabiliser by the sol–gel method. A detailed thermogravimetric analysis study of the influence of processing parameters, including DPDMS content, UV irradiation and sol ageing, on the thermal stability of the resultant thin films was presented. FT-IR spectroscopy was used to monitor the changes in the relative amount of epoxy rings in the system during processing. It was demonstrated that the crosslinking of epoxy groups in the structure is the primary reason for changes in the thermal stability of the system. It was also shown that the thermal stability, in terms of 10% mass loss, of the material system could be improved up to 280 °C, by adjusting the preparation conditions, compatible with several subsequent high temperature optoelectronic integration processes.