Miniaturized Electronics

Semiconductor device and circuit technology, coupled with its associated electronic packaging, forms the backbone of high-performance miniaturized electronic systems. This article examines some of the current and future electronic device technology that is, or will be, important to APL. It also looks at the latest trends in packaging and how packaging is key to the development of high-performance systems. This integration of advanced devices with high-density packaging has been a cornerstone of APL activities, ranging from the VT fuze to the latest satellite. A glimpse into the potential of increased silicon integration, wide bandgap semiconductors, and carbon nanotubes for greater device performance is presented. The packaging discussion focuses on advanced interconnect and the use of flexible substrates.