Microstructure and strength of bump joints in photodiode packages
The joint strength and fracture surfaces of Sn-Pb and Au stud bumps for photodiode packages after isothermal aging were studied experimentally. Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joi...
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| Veröffentlicht in: | Journal of electronic materials 2004, Vol.33 (1), p.70-75 |
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| creator | KIM, Kyung-Seob KIM, Nam-Kyu YU, Chung-Hee KIM, Joong-Jung CHANG, Eui-Goo |
| description | The joint strength and fracture surfaces of Sn-Pb and Au stud bumps for photodiode packages after isothermal aging were studied experimentally. Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joint strength decreased with aging time. The diffraction patterns of Cu(6)Sn(5), scallop-shaped IMCs, and planar-shaped Cu(3)Sn were characterized by transmission electron microscopy (TEM). The IMCs between Au stud bumps and Al pads was identified as AlAu(2). The formation of Kirkendall voids and the growth of IMCs at the solder joint were found to be a possible mechanism for joint strength reduction. |
| doi_str_mv | 10.1007/s11664-004-0296-2 |
| format | Article |
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Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joint strength decreased with aging time. The diffraction patterns of Cu(6)Sn(5), scallop-shaped IMCs, and planar-shaped Cu(3)Sn were characterized by transmission electron microscopy (TEM). The IMCs between Au stud bumps and Al pads was identified as AlAu(2). The formation of Kirkendall voids and the growth of IMCs at the solder joint were found to be a possible mechanism for joint strength reduction.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/s11664-004-0296-2</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>New York, NY: Institute of Electrical and Electronics Engineers</publisher><subject>Applied sciences ; Cross-disciplinary physics: materials science; rheology ; Electron microscopes ; Electronics ; Exact sciences and technology ; Intermetallic compounds ; Joint strength ; Materials science ; Optoelectronic devices ; Photodiodes; phototransistors; photoresistors ; Physics ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Soldering ; Solid solution hardening, precipitation hardening, and dispersion hardening; aging ; Solid solution, precipitation, and dispersion hardening; aging ; Treatment of materials and its effects on microstructure and properties</subject><ispartof>Journal of electronic materials, 2004, Vol.33 (1), p.70-75</ispartof><rights>2004 INIST-CNRS</rights><rights>Copyright Minerals, Metals & Materials Society Jan 2004</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c362t-165d05ea5a1d55a350e7ae49fd0d440832c95f99a32670da9ddf8d968d85548c3</citedby><cites>FETCH-LOGICAL-c362t-165d05ea5a1d55a350e7ae49fd0d440832c95f99a32670da9ddf8d968d85548c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,4024,27923,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=15396185$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>KIM, Kyung-Seob</creatorcontrib><creatorcontrib>KIM, Nam-Kyu</creatorcontrib><creatorcontrib>YU, Chung-Hee</creatorcontrib><creatorcontrib>KIM, Joong-Jung</creatorcontrib><creatorcontrib>CHANG, Eui-Goo</creatorcontrib><title>Microstructure and strength of bump joints in photodiode packages</title><title>Journal of electronic materials</title><description>The joint strength and fracture surfaces of Sn-Pb and Au stud bumps for photodiode packages after isothermal aging were studied experimentally. Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joint strength decreased with aging time. The diffraction patterns of Cu(6)Sn(5), scallop-shaped IMCs, and planar-shaped Cu(3)Sn were characterized by transmission electron microscopy (TEM). The IMCs between Au stud bumps and Al pads was identified as AlAu(2). The formation of Kirkendall voids and the growth of IMCs at the solder joint were found to be a possible mechanism for joint strength reduction.</description><subject>Applied sciences</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Electron microscopes</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Intermetallic compounds</subject><subject>Joint strength</subject><subject>Materials science</subject><subject>Optoelectronic devices</subject><subject>Photodiodes; phototransistors; photoresistors</subject><subject>Physics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Soldering</subject><subject>Solid solution hardening, precipitation hardening, and dispersion hardening; aging</subject><subject>Solid solution, precipitation, and dispersion hardening; aging</subject><subject>Treatment of materials and its effects on microstructure and properties</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><sourceid>8G5</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><sourceid>GUQSH</sourceid><sourceid>M2O</sourceid><recordid>eNqFkE1LxDAQhoMouK7-AG9B0Fs1H500OS6LX6B4UfAWYpLudu02NUkP_ntbdkHw4mEYBp73hXkQOqfkmhJS3SRKhSgLQsZhShTsAM0olLygUrwfohnhghbAOByjk5Q2hFCgks7Q4rmxMaQcB5uH6LHpHB4v363yGocafwzbHm9C0-WEmw7365CDa4LzuDf206x8OkVHtWmTP9vvOXq7u31dPhRPL_ePy8VTYblguaACHAFvwFAHYDgQXxlfqtoRV5ZEcmYV1EoZzkRFnFHO1dIpIZ0EKKXlc3S16-1j-Bp8ynrbJOvb1nQ-DEkzxYEJqf4HJRs1iWoEL_6AmzDEbnxCM1KqyRAbIbqDJk0p-lr3sdma-K0p0ZN6vVOvx049qddT5nJfbJI1bR1NZ5v0GwSuBJXAfwB98oKv</recordid><startdate>2004</startdate><enddate>2004</enddate><creator>KIM, Kyung-Seob</creator><creator>KIM, Nam-Kyu</creator><creator>YU, Chung-Hee</creator><creator>KIM, Joong-Jung</creator><creator>CHANG, Eui-Goo</creator><general>Institute of Electrical and Electronics Engineers</general><general>Springer Nature B.V</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>3V.</scope><scope>7XB</scope><scope>88I</scope><scope>8AF</scope><scope>8AO</scope><scope>8FE</scope><scope>8FG</scope><scope>8FK</scope><scope>8G5</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>ARAPS</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>GNUQQ</scope><scope>GUQSH</scope><scope>HCIFZ</scope><scope>KB.</scope><scope>L6V</scope><scope>M2O</scope><scope>M2P</scope><scope>M7S</scope><scope>MBDVC</scope><scope>P5Z</scope><scope>P62</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>PTHSS</scope><scope>Q9U</scope><scope>S0X</scope><scope>7QF</scope><scope>7SP</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8D</scope><scope>JG9</scope><scope>L7M</scope><scope>7TB</scope><scope>FR3</scope></search><sort><creationdate>2004</creationdate><title>Microstructure and strength of bump joints in photodiode packages</title><author>KIM, Kyung-Seob ; KIM, Nam-Kyu ; YU, Chung-Hee ; KIM, Joong-Jung ; CHANG, Eui-Goo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c362t-165d05ea5a1d55a350e7ae49fd0d440832c95f99a32670da9ddf8d968d85548c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Applied sciences</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Electron microscopes</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Intermetallic compounds</topic><topic>Joint strength</topic><topic>Materials science</topic><topic>Optoelectronic devices</topic><topic>Photodiodes; phototransistors; photoresistors</topic><topic>Physics</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Soldering</topic><topic>Solid solution hardening, precipitation hardening, and dispersion hardening; aging</topic><topic>Solid solution, precipitation, and dispersion hardening; aging</topic><topic>Treatment of materials and its effects on microstructure and properties</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>KIM, Kyung-Seob</creatorcontrib><creatorcontrib>KIM, Nam-Kyu</creatorcontrib><creatorcontrib>YU, Chung-Hee</creatorcontrib><creatorcontrib>KIM, Joong-Jung</creatorcontrib><creatorcontrib>CHANG, Eui-Goo</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>ProQuest Central (Corporate)</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>Science Database (Alumni Edition)</collection><collection>STEM Database</collection><collection>ProQuest Pharma Collection</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>ProQuest Central (Alumni) (purchase pre-March 2016)</collection><collection>Research Library (Alumni Edition)</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central (Alumni Edition)</collection><collection>ProQuest Central UK/Ireland</collection><collection>Advanced Technologies & Aerospace Collection</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>ProQuest Central Student</collection><collection>Research Library Prep</collection><collection>SciTech Premium Collection</collection><collection>Materials Science Database</collection><collection>ProQuest Engineering Collection</collection><collection>Research Library</collection><collection>Science Database</collection><collection>Engineering Database</collection><collection>Research Library (Corporate)</collection><collection>Advanced Technologies & Aerospace Database</collection><collection>ProQuest Advanced Technologies & Aerospace Collection</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Engineering Collection</collection><collection>ProQuest Central Basic</collection><collection>SIRS Editorial</collection><collection>Aluminium Industry Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Materials Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Engineering Research Database</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>KIM, Kyung-Seob</au><au>KIM, Nam-Kyu</au><au>YU, Chung-Hee</au><au>KIM, Joong-Jung</au><au>CHANG, Eui-Goo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Microstructure and strength of bump joints in photodiode packages</atitle><jtitle>Journal of electronic materials</jtitle><date>2004</date><risdate>2004</risdate><volume>33</volume><issue>1</issue><spage>70</spage><epage>75</epage><pages>70-75</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>The joint strength and fracture surfaces of Sn-Pb and Au stud bumps for photodiode packages after isothermal aging were studied experimentally. Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joint strength decreased with aging time. The diffraction patterns of Cu(6)Sn(5), scallop-shaped IMCs, and planar-shaped Cu(3)Sn were characterized by transmission electron microscopy (TEM). The IMCs between Au stud bumps and Al pads was identified as AlAu(2). The formation of Kirkendall voids and the growth of IMCs at the solder joint were found to be a possible mechanism for joint strength reduction.</abstract><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/s11664-004-0296-2</doi><tpages>6</tpages></addata></record> |
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| subjects | Applied sciences Cross-disciplinary physics: materials science rheology Electron microscopes Electronics Exact sciences and technology Intermetallic compounds Joint strength Materials science Optoelectronic devices Photodiodes phototransistors photoresistors Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Solid solution hardening, precipitation hardening, and dispersion hardening aging Solid solution, precipitation, and dispersion hardening aging Treatment of materials and its effects on microstructure and properties |
| title | Microstructure and strength of bump joints in photodiode packages |
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