Microstructure and strength of bump joints in photodiode packages

The joint strength and fracture surfaces of Sn-Pb and Au stud bumps for photodiode packages after isothermal aging were studied experimentally. Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joi...

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Veröffentlicht in:	Journal of electronic materials 2004, Vol.33 (1), p.70-75
Hauptverfasser:	KIM, Kyung-Seob, KIM, Nam-Kyu, YU, Chung-Hee, KIM, Joong-Jung, CHANG, Eui-Goo
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cross-disciplinary physics: materials science rheology Electron microscopes Electronics Exact sciences and technology Intermetallic compounds Joint strength Materials science Optoelectronic devices Photodiodes phototransistors photoresistors Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Solid solution hardening, precipitation hardening, and dispersion hardening aging Solid solution, precipitation, and dispersion hardening aging Treatment of materials and its effects on microstructure and properties
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Beschreibung
Zusammenfassung:	The joint strength and fracture surfaces of Sn-Pb and Au stud bumps for photodiode packages after isothermal aging were studied experimentally. Aluminum/gold stud bumps and Cu/Sn-Pb solders were adopted and aged for up to 900 h to analyze the effect of intermetallic compound (IMC) formation. The joint strength decreased with aging time. The diffraction patterns of Cu(6)Sn(5), scallop-shaped IMCs, and planar-shaped Cu(3)Sn were characterized by transmission electron microscopy (TEM). The IMCs between Au stud bumps and Al pads was identified as AlAu(2). The formation of Kirkendall voids and the growth of IMCs at the solder joint were found to be a possible mechanism for joint strength reduction.
ISSN:	0361-5235 1543-186X
DOI:	10.1007/s11664-004-0296-2