Profiled Metal-Ceramic Micropackages for Power Microwave Diodes

The present paper refers to the manufacturing of some profiled (leadless inverted devices-LID) metal-ceramic micropackages for which metal-ceramic joining is realised by the metal to metal diffusion mechanism. Using corundum ceramic and electronic purity materials, the ceramic micropackages have been realized by adapting technological processes (deposition of metallic films, etching, etc.) and equipment specific to the electronic component industry. Profiled metal-ceramic micropackages, have been used to encapsulate some types of power microwave diodes, Pin, Schottky.