Centrifugal Sintering of Copper

The ceramic film with thickness of several ten mum to several mm on a substrate and small ceramic piece with a complicated shape have been interested because of highly integrated, small electric devices. In this work, we suggest novel centrifugal sintering method, which can be sintered ceramic film and small ceramic piece by applying high pressure without pressure medium, and its processing merit. Furthermore, outline of installed sintering equipment and experimental result were shown. (Substrate: silica glass.)