A compliant end-effector for microscribing

A new end-effector was designed and built for microscribing processes using principles of compliant mechanisms. Initial testing of a chemomechanical microscribing process showed that low forces produce lines that are significantly smoother, more uniform, and exhibit less material chipping. From the testing it is apparent that there is a need for a specialized precision end-effector that (1) is passively controlled, (2) has low axial stiffness, and (3) has high lateral stiffness. To meet these needs a three segment folded-beam compliant mechanism was chosen. This design is passively controlled, has a high axial/lateral stiffness ratio, is ideal for clean sensitive applications, and can be designed for a range of low forces. The axial stiffness of the end-effector was modeled using both the compliant mechanism pseudo-rigid body model and linear-elastic beam theory. The lateral stiffness was modeled using FEA techniques. Ratios of lateral stiffness to axial stiffness were found to be nearly 1000:1. A fatigue analysis was also performed and it was determined that the mechanism could reach approximately 1 billion cycles before failure. The compliant end-effector design is a significant improvement over existing scribing alternatives and can produce smooth and uniform scribed lines that exhibit less material chipping.