Electrical conductivity and photoreflectance of nanocrystalline copper nitride thin films deposited at low temperature

Nanocrystalline thin films of copper nitride were grown on Si (1 0 0) wafers at a low substrate temperature by reactive magnetron sputtering of Cu target with the mixture of nitrogen and argon. The influence of nitrogen deficiency upon the structural, optical and electrical properties of as-deposited films was investigated. X-ray diffraction confirms the presence of cubic Cu 3N and Cu biphases irrespective of carefully optimized processing parameters. With a Cu content approaching the stoichiometry for Cu 3N, the films assume a smooth morphology with densely-packed nanocrystallites of about 40–60 nm in size. Those deposits containing more than 79% Cu are metallic conductors with excellent electrical conductivity via a percolation mechanism, whereas the slightly substoichiometric Cu 3N films show a typical behavior of deficit semiconductor, with an optical gap of about 1.85 eV as revealed by photoreflectance measurement. All the observations are discussed in terms of nitrogen reemission from the growing film.