Co-Firing and Shrinkage Matching in Low- and Middle- Permittivity Dielectric Compositions for a Low-Temperature Co-Fired Ceramics System

Co‐firing and shrinkage matching of low‐ and middle‐ permittivity dielectric compositions for the application to a low‐temperature co‐fired ceramics system was investigated. Several glass compositions were initially examined for the low‐temperature firing of middle‐K (K∼20) dielectrics, and their compositions were further modified for shrinkage matching between low‐K (K∼6) and middle‐K layers. By controlling the processing parameters such as the solid loading ratio and stacking sequence, the warpages between hetero‐layers could be minimized.