Josephson-like properties of YBa(2)Cu(3)O(7 ) thin film weak links
Thin-film YBa(2)Cu(3)O(7) microbridges have been fabricated by photo- and e-beam lithography in polycrystalline thin films grown on MgO substrates and containing a controlled density of large-angle tilt boundaries, thereby isolating individual tilt-boundary weak links. Depending on the growth parame...
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Veröffentlicht in: | IEEE transactions on magnetics 1991-03, Vol.27 (2), p.3203-3208 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Thin-film YBa(2)Cu(3)O(7) microbridges have been fabricated by photo- and e-beam lithography in polycrystalline thin films grown on MgO substrates and containing a controlled density of large-angle tilt boundaries, thereby isolating individual tilt-boundary weak links. Depending on the growth parameters of the film, such weak links have critical current densities < e1 > J < /e1 > (c ) ranging from < 10(4) A|cm(2) to > 10(6 ) A|cm(2). The higher < e1 > J < /e1 > (c) microbridges exhibit behavior indicative of one-dimensional flux flow and flux creep in the weak links, while the lower < e1 > J < /e1 > (c) microbridges have RSJ-like properties. Detailed comparisons have been made between the predictions of the resistively shunted junction (RSJ) model including the calculated effects of thermal noise rounding and the measured DC and microwave response of these weak links. Measurements have also been made of magnetic field effects on the critical current density. An unexpected scaling behavior has been observed in the < e1 > I < /e1 > - < e1 > V < /e1 > characteristics of certain types of these microbridges containing 45 deg tilt boundaries that indicates that in those cases < e1 > I < /e1 > (C) < e1 > R < /e1 > (N)(2) is a constant for the tilt-boundary weak link. The implications of these results for developing a successful description of the superconductive properties of YBa(2)Cu(3)O(7) grain boundary weak links, which electron microscopy reveals to be clean, stoichiometric, and abrupt, are discussed |
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ISSN: | 0018-9464 |
DOI: | 10.1109/20.133996 |