Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

Dissolution and interface reactions between the 95.5Sn-3.9Ag-0.6Cu, 99.3Sn-0.7Cu, and 63Sn-37Pb solders on silver base metal

Dissolution and intermetallic compound (IMC) layer development were examined for couples formed between 99.9 silver (Ag) and molten 95.5Sn-3.9Ag-0.6Cu (wt pct), 99.3Sn-0.7Cu, and 63Sn-37Pb solders, using a range of solder temperatures and exposure times. The interface reactions that controlled Ag di...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2006-05, Vol.37 (5), p.1551-1561
Hauptverfasser: VIANCO, Paul T, MARTIN, Joseph J, WRIGHT, Robert D, HLAVA, Paul F
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Brazing. Soldering
Copper
Dissolution
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Metals
Metals. Metallurgy
Microstructure
Soldering
Temperature
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Dissolution and intermetallic compound (IMC) layer development were examined for couples formed between 99.9 silver (Ag) and molten 95.5Sn-3.9Ag-0.6Cu (wt pct), 99.3Sn-0.7Cu, and 63Sn-37Pb solders, using a range of solder temperatures and exposure times. The interface reactions that controlled Ag dissolution were sensitive to the solder composition. The Ag^sub 3^Sn IMC layer thickness and interface microstructure as a whole exhibited nonmonotonic trends and were controlled primarily by the near-interface solder composition. The kinetics of IMC layer growth were weakly dependent upon the solder composition. The processes of Ag dissolution and IMC layer growth were independent of one another. [PUBLICATION ABSTRACT]
ISSN:1073-5623
1543-1940
DOI:10.1007/s11661-006-0099-6