Low temperature, high growth rate epitaxial silicon and silicon germanium alloy films

Epitaxial growth of silicon and silicon germanium alloy films on Si(1 0 0) substrates in an ASM Epsilon ® single wafer reactor system using trisilane and germane has been investigated. The results obtained reveal that it is possible to achieve epitaxial silicon and silicon germanium growth rates at...

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Veröffentlicht in:Applied surface science 2004-03, Vol.224 (1), p.41-45
Hauptverfasser: Todd, Michael A, Weeks, Keith D
Format: Artikel
Sprache:eng
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Zusammenfassung:Epitaxial growth of silicon and silicon germanium alloy films on Si(1 0 0) substrates in an ASM Epsilon ® single wafer reactor system using trisilane and germane has been investigated. The results obtained reveal that it is possible to achieve epitaxial silicon and silicon germanium growth rates at 630 °C and below that are substantially higher than those possible using silane, while maintaining high quality crystalline structure. The films grown were characterized using Rutherford backscattering spectroscopy (RBS), high resolution X-Ray diffraction (HR-XRD), atomic force microscopy (AFM) and high resolution cross-sectional transmission electron microscopy (X-TEM).
ISSN:0169-4332
1873-5584
DOI:10.1016/j.apsusc.2003.08.067