Ge diffusion and solid phase epitaxy growth to form Si1-xGex/Si and Ge on insulator structure

We report growth of Si1-xGex/Si and Ge on insulator by Ge diffusion and SPE (solid phase epitaxy). Different annealing conditions were carried out and evaluated by X-ray diffraction. Ge diffusion and SPE growth of Ge on Si are observed after annealing at 800 DGC. EDX (electron dispersive X-ray) comp...

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Veröffentlicht in:Thin solid films 2006-05, Vol.504 (1-2), p.69-72
Hauptverfasser: FEI GAO, LEE, S. J, BALAKUMAR, S, ANYAN DU, FOO, Yong-Lim, KWONG, Dim-Lee
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Sprache:eng
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Zusammenfassung:We report growth of Si1-xGex/Si and Ge on insulator by Ge diffusion and SPE (solid phase epitaxy). Different annealing conditions were carried out and evaluated by X-ray diffraction. Ge diffusion and SPE growth of Ge on Si are observed after annealing at 800 DGC. EDX (electron dispersive X-ray) composition analysis shows that the top 100 A Si1-xGex layer is quite uniform with Ge content variation of less than 2%. TEM (transmission electron microscopy) picture shows no crystal orientation misalignment between the Si and the top Si1-xGex layer. This simple and cost-effective process can be used to make Si1-xGex /Si substrate for high-mobility metal oxide semiconductor field effect transistor application. In addition, Ge on insulator structure was achieved by SPE lateral growth on pre-patterned SiO2.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2005.09.043