Predicting thickness dependent twin boundary formation in sputtered Cu films

Predicting thickness dependent twin boundary formation in sputtered Cu films

Triple junctions involving twin boundaries in Cu interconnects of integrated circuits have been shown to be potentially detrimental to the manufacturability of the circuit. Microstructures of annealed Cu films are dependent on film thickness and deposition parameters. This work describes texture and...

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Veröffentlicht in:Scripta materialia 2006-03, Vol.54 (6), p.999-1003
Hauptverfasser: Park, N.-J., Field, D.P.
Format: Artikel
Sprache:eng
Schlagworte:
Annealing
ANNEALING PROCESSES
BOUNDARIES
CONNECTORS (ELECTRICAL)
Copper
Copper films
DEPOSITION
Electron backscatter diffraction (EBSD)
Film thickness
INTEGRATED CIRCUITS
Manufacturability
SPUTTERING
Surface layer
Texture
TEXTURES
TWIN BOUNDARIES
TWINNING MECHANISMS
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Beschreibung
Zusammenfassung:Triple junctions involving twin boundaries in Cu interconnects of integrated circuits have been shown to be potentially detrimental to the manufacturability of the circuit. Microstructures of annealed Cu films are dependent on film thickness and deposition parameters. This work describes texture and twin boundary development in sputtered and annealed Cu films.
ISSN:1359-6462
0956-716X
1872-8456
DOI:10.1016/j.scriptamat.2005.11.041