High density nano-scale twins in Cu induced by dynamic plastic deformation

Flaw-free bulk Cu specimens with a high density of nano-scale mechanical twins were produced by means of dynamic plastic deformation at liquid nitrogen temperature. The nano-twinned Cu exhibits a tensile yield strength of 600 MPa and an elongation-to-failure of 11%. The significant strengthening ori...

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Veröffentlicht in:	Scripta materialia 2005-09, Vol.53 (6), p.745-749
Hauptverfasser:	Zhao, W.S., Tao, N.R., Guo, J.Y., Lu, Q.H., Lu, K.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences COMPOSITES Copper DEFORMATION DENSITY DISLOCATIONS Dynamic plastic deformation Dynamics Exact sciences and technology High density High tensile strength Mechanical properties and methods of testing. Rheology. Fracture mechanics. Tribology Metals. Metallurgy MICROSTRUCTURES Nano-scale twins Nanocomposites Nanomaterials Nanostructure Nanostructured Cu Plastic deformation PLASTIC STRAIN TWINNING MECHANISMS YIELD STRENGTH
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Beschreibung
Zusammenfassung:	Flaw-free bulk Cu specimens with a high density of nano-scale mechanical twins were produced by means of dynamic plastic deformation at liquid nitrogen temperature. The nano-twinned Cu exhibits a tensile yield strength of 600 MPa and an elongation-to-failure of 11%. The significant strengthening originates from the effective blockage of glide dislocations by numerous twin boundaries and dislocations.
ISSN:	1359-6462 0956-716X 1872-8456
DOI:	10.1016/j.scriptamat.2005.05.022