Thermo-mechanical properties and regression models of alloys: AISI 305, CK 60, CuBe2 and Laiton MS 63
Accurate and reliable thermo-mechanical properties, such as thermal conductivity, coefficient of thermal expansion and thermal flow stress, are essential requirements for quantitative models describing materials processing at elevated temperatures. Experimental data of these properties for some mate...
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Veröffentlicht in: | Journal of materials processing technology 2005-09, Vol.168 (1), p.152-163 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Accurate and reliable thermo-mechanical properties, such as thermal conductivity, coefficient of thermal expansion and thermal flow stress, are essential requirements for quantitative models describing materials processing at elevated temperatures. Experimental data of these properties for some materials are, however, still limited. In this paper, an electro-thermo-mechanical technique (ETMT) is used to experimentally measure electrical conductivity, thermal conductivity, thermal expansion and the stress–strain–temperature response for four industrial alloys: stainless steel AISI 305, high carbon steel CK 60, and copper alloys CuBe2 and Laiton MS 63. The experimental temperature regimes vary from room temperature to the incipient melting points of these alloys. Based on the experimentally measured data, the least squares fit method is used to statistically derive regression models for these properties for all the test alloys. The derived empirical models of electrical resistivity, thermal conductivity, and coefficient of linear thermal expansion have been shown to accurately describe more than 90% of the variability in their experimentally measured values. These results are compared with data in the literature. The multiple regression model of thermal flow stress with two independent variables at a logarithmic true-strain and exponential square temperature of unity has a good fit to the experimental data of the four test alloys. |
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ISSN: | 0924-0136 |
DOI: | 10.1016/j.jmatprotec.2004.11.011 |