The formation of low-dimensional structures by compressive plasma flows

The process of the deposition of low-dimensional structures on the silicon surface exposed to the compression plasma flow has been studied. Scanning electron microscopy, transmission electron microscopy and Rutherford backscattering spectroscopy have been used to analyze the morphology, microstructu...

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Veröffentlicht in:	Surface & coatings technology 2005-10, Vol.200 (1-4), p.297-300
Hauptverfasser:	Uglov, V.V., Anishchik, V.M., Cherenda, N.N., Sveshnikov, Yu. V., Astashynski, V.M., Kostyukevich, E.A., Kuzmitski, A.M., Askerko, V.V., Thorwath, G., Stritzker, B., Kvasov, N.T., Danilyuk, L.A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences B Rutherford backscattering spectroscopy B Scanning electron microscopy B Transmission electron microscopy C Pulsed plasma Cross-disciplinary physics: materials science rheology D Silicon Exact sciences and technology Materials science Metals. Metallurgy Other topics in materials science Physics Production techniques Surface treatment X Low-dimensional coating deposition
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Beschreibung
Zusammenfassung:	The process of the deposition of low-dimensional structures on the silicon surface exposed to the compression plasma flow has been studied. Scanning electron microscopy, transmission electron microscopy and Rutherford backscattering spectroscopy have been used to analyze the morphology, microstructure and elemental composition of the near-surface layer. The deposited coating consists of a spherical metal containing particles with a size of 50–200 nm. Possible mechanism of the coating formation is discussed.
ISSN:	0257-8972 1879-3347
DOI:	10.1016/j.surfcoat.2005.02.007