Wetting, adhesion and diffusion in Cu- Al/SiO2 system at 1473 K

Wetting, adhesion and diffusion in Cu- Al/SiO2 system at 1473 K

Sessile-drop wetting experiments and interfacial microstructure examinations show that at high temperature, Cu alloyed with Al mildly promotes the wettability, yet fails to enhance the adhesion and impede the thermal diffusion between Cu and SiO2, in contrast to the behavior observed in low-temperat...

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Veröffentlicht in:Scripta materialia 2005-06, Vol.52 (12), p.1259-1263
Hauptverfasser: PING SHEN, FUJII, Hidetoshi, NOGI, Kiyoshi
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Exact sciences and technology
Metals. Metallurgy
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Zusammenfassung:Sessile-drop wetting experiments and interfacial microstructure examinations show that at high temperature, Cu alloyed with Al mildly promotes the wettability, yet fails to enhance the adhesion and impede the thermal diffusion between Cu and SiO2, in contrast to the behavior observed in low-temperature annealing studies.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2005.02.019