Application of push-off shear test for evaluation of wetting-interface structure-bonding relationship of solder joints

The relationship between wetting behavior, interface structure and mechanical properties of solder/substrate couples has been studied on example of Sn-alloys and Cu substrates. The sessile drop method was used to investigate the solder wetting and spreading on polished Cu substrates in vacuum at a temperature of 503 K. The sessile drop samples after solidification were bisected perpendicularly to the substrate at the mid-plane of the contact circle. The first half of each sample was used for structural characterization of interfaces and evaluation of their mechanical properties by improved push-off shear test. The second half was used for investigation of the effect of thermocycling on structural stability and corresponding mechanical behavior of model solder/Cu joints. A comparison with the results obtained on standard solder joints has shown the usefulness of the improved push-off shear test performed directly on solidified sessile drop samples as an express test for evaluation of technological and mechanical compatibility of solder/substrate couples, particularly at the first stage of solder candidate selection.