Early history of vacuum arc deposition
Vacuum arc deposition (VAD) was first investigated at the end of the 19th century by A. W. Wright and T. A. Edison, as mirror coatings and seed layers for phonogram replication molds, respectively. The early research anticipated later developments, including cathode shielding, multi-layer coatings,...
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Veröffentlicht in: | IEEE transactions on plasma science 2001-10, Vol.29 (5), p.759-761 |
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description | Vacuum arc deposition (VAD) was first investigated at the end of the 19th century by A. W. Wright and T. A. Edison, as mirror coatings and seed layers for phonogram replication molds, respectively. The early research anticipated later developments, including cathode shielding, multi-layer coatings, substrate motion, and hybrid processing. |
doi_str_mv | 10.1109/27.964470 |
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W. Wright and T. A. Edison, as mirror coatings and seed layers for phonogram replication molds, respectively. The early research anticipated later developments, including cathode shielding, multi-layer coatings, substrate motion, and hybrid processing.</description><identifier>ISSN: 0093-3813</identifier><identifier>EISSN: 1939-9375</identifier><identifier>DOI: 10.1109/27.964470</identifier><identifier>CODEN: ITPSBD</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Arc deposition ; Cathodes ; Cathodic coating (process) ; Coatings ; Edison, Thomas Alva (1847-1931) ; Electricity ; Electrodes ; Electron tubes ; Experiments ; Glass ; Helium ; History ; Molds ; Multilayers ; Plasma ; Replication ; Scientists ; Seeds ; Shielding ; Switches ; Transistors ; Vacuum arcs ; Wright, Arthur W</subject><ispartof>IEEE transactions on plasma science, 2001-10, Vol.29 (5), p.759-761</ispartof><rights>Copyright Institute of Electrical and Electronics Engineers, Inc. (IEEE) Oct 2001</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c336t-a8f4dbfed9927bfaf33b5fcc7ee8539d72ac75384da73a96a683c9d026fc71573</citedby><cites>FETCH-LOGICAL-c336t-a8f4dbfed9927bfaf33b5fcc7ee8539d72ac75384da73a96a683c9d026fc71573</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/964470$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/964470$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Boxman, R.L.</creatorcontrib><title>Early history of vacuum arc deposition</title><title>IEEE transactions on plasma science</title><addtitle>TPS</addtitle><description>Vacuum arc deposition (VAD) was first investigated at the end of the 19th century by A. W. Wright and T. A. Edison, as mirror coatings and seed layers for phonogram replication molds, respectively. The early research anticipated later developments, including cathode shielding, multi-layer coatings, substrate motion, and hybrid processing.</description><subject>Arc deposition</subject><subject>Cathodes</subject><subject>Cathodic coating (process)</subject><subject>Coatings</subject><subject>Edison, Thomas Alva (1847-1931)</subject><subject>Electricity</subject><subject>Electrodes</subject><subject>Electron tubes</subject><subject>Experiments</subject><subject>Glass</subject><subject>Helium</subject><subject>History</subject><subject>Molds</subject><subject>Multilayers</subject><subject>Plasma</subject><subject>Replication</subject><subject>Scientists</subject><subject>Seeds</subject><subject>Shielding</subject><subject>Switches</subject><subject>Transistors</subject><subject>Vacuum arcs</subject><subject>Wright, Arthur W</subject><issn>0093-3813</issn><issn>1939-9375</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNp90L1LAzEYBvAgCtbq4Op0OFQcriZ58zlKqR9QcNE55HIJXrk2NbkT-t975YqDg9M7vD8eeB6ErgmeE4L1A5VzLRiT-ARNiAZdapD8FE0w1lCCInCOLnJeY0wYx3SCZkub2n3x2eQupn0RQ_FtXd9vCptcUftdzE3XxO0lOgu2zf7qeKfo42n5vngpV2_Pr4vHVekARFdaFVhdBV9rTWUVbACoeHBOeq846FpS6yQHxWorwWphhQKna0xFcJJwCVN0N-buUvzqfe7MpsnOt63d-thnowkTnHNKBzn7V1LFlSLqEHn7B65jn7ZDC0M0J0JixQZ0PyKXYs7JB7NLzcamvSHYHIY1VJpx2MHejLbx3v-64_MH64txNw</recordid><startdate>20011001</startdate><enddate>20011001</enddate><creator>Boxman, R.L.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope><scope>F28</scope><scope>FR3</scope></search><sort><creationdate>20011001</creationdate><title>Early history of vacuum arc deposition</title><author>Boxman, R.L.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c336t-a8f4dbfed9927bfaf33b5fcc7ee8539d72ac75384da73a96a683c9d026fc71573</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Arc deposition</topic><topic>Cathodes</topic><topic>Cathodic coating (process)</topic><topic>Coatings</topic><topic>Edison, Thomas Alva (1847-1931)</topic><topic>Electricity</topic><topic>Electrodes</topic><topic>Electron tubes</topic><topic>Experiments</topic><topic>Glass</topic><topic>Helium</topic><topic>History</topic><topic>Molds</topic><topic>Multilayers</topic><topic>Plasma</topic><topic>Replication</topic><topic>Scientists</topic><topic>Seeds</topic><topic>Shielding</topic><topic>Switches</topic><topic>Transistors</topic><topic>Vacuum arcs</topic><topic>Wright, Arthur W</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Boxman, R.L.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><jtitle>IEEE transactions on plasma science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Boxman, R.L.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Early history of vacuum arc deposition</atitle><jtitle>IEEE transactions on plasma science</jtitle><stitle>TPS</stitle><date>2001-10-01</date><risdate>2001</risdate><volume>29</volume><issue>5</issue><spage>759</spage><epage>761</epage><pages>759-761</pages><issn>0093-3813</issn><eissn>1939-9375</eissn><coden>ITPSBD</coden><abstract>Vacuum arc deposition (VAD) was first investigated at the end of the 19th century by A. W. Wright and T. A. Edison, as mirror coatings and seed layers for phonogram replication molds, respectively. The early research anticipated later developments, including cathode shielding, multi-layer coatings, substrate motion, and hybrid processing.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/27.964470</doi><tpages>3</tpages></addata></record> |
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subjects | Arc deposition Cathodes Cathodic coating (process) Coatings Edison, Thomas Alva (1847-1931) Electricity Electrodes Electron tubes Experiments Glass Helium History Molds Multilayers Plasma Replication Scientists Seeds Shielding Switches Transistors Vacuum arcs Wright, Arthur W |
title | Early history of vacuum arc deposition |
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