Activation of boron and phosphorus atoms implanted in polycrystalline silicon films at low temperatures

Phosphorus atoms implanted in laser crystallized polycrystalline silicon films were activated by a heat treatment in air at 260 °C for 1, 3 and 24 h. Analysis of ultraviolet reflectivity of phosphorus-doped silicon films implanted by ion doping method at 4 keV revealed that the thickness of the top...

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Veröffentlicht in:Thin solid films 2005-09, Vol.487 (1), p.252-254
Hauptverfasser: Andoh, Nobuyuki, Sameshima, Toshiyuki, Andoh, Yasunori
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container_title Thin solid films
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creator Andoh, Nobuyuki
Sameshima, Toshiyuki
Andoh, Yasunori
description Phosphorus atoms implanted in laser crystallized polycrystalline silicon films were activated by a heat treatment in air at 260 °C for 1, 3 and 24 h. Analysis of ultraviolet reflectivity of phosphorus-doped silicon films implanted by ion doping method at 4 keV revealed that the thickness of the top disordered layer formed by ion bombardment was 6 nm. It is reduced to 4 nm by a 3 h heat treatment at 260 °C by recrystallization of disordered region. The electrical conductance of silicon films implanted increased to 1.7×10 5 S/sq after 3 h heat treatment.
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subjects Condensed matter: electronic structure, electrical, magnetic, and optical properties
Condensed matter: structure, mechanical and thermal properties
Cross-disciplinary physics: materials science
rheology
Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures
Exact sciences and technology
Growth from solid phases (including multiphase diffusion and recrystallization)
Impurity activation
Ion doping
Low temperature
Materials science
Methods of crystal growth
physics of crystal growth
Physics
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
title Activation of boron and phosphorus atoms implanted in polycrystalline silicon films at low temperatures
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