Activation of boron and phosphorus atoms implanted in polycrystalline silicon films at low temperatures

Phosphorus atoms implanted in laser crystallized polycrystalline silicon films were activated by a heat treatment in air at 260 °C for 1, 3 and 24 h. Analysis of ultraviolet reflectivity of phosphorus-doped silicon films implanted by ion doping method at 4 keV revealed that the thickness of the top...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Thin solid films 2005-09, Vol.487 (1), p.252-254
Hauptverfasser: Andoh, Nobuyuki, Sameshima, Toshiyuki, Andoh, Yasunori
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Phosphorus atoms implanted in laser crystallized polycrystalline silicon films were activated by a heat treatment in air at 260 °C for 1, 3 and 24 h. Analysis of ultraviolet reflectivity of phosphorus-doped silicon films implanted by ion doping method at 4 keV revealed that the thickness of the top disordered layer formed by ion bombardment was 6 nm. It is reduced to 4 nm by a 3 h heat treatment at 260 °C by recrystallization of disordered region. The electrical conductance of silicon films implanted increased to 1.7×10 5 S/sq after 3 h heat treatment.
ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2005.01.074