A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface

A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface

A novel technique for suppressing power plane resonance at microwave and radio frequencies is presented. The new concept consists of replacing one of the plates of a parallel power plane pair with a high impedance surface or electromagnetic band gap structure. The combination of this technique with...

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Veröffentlicht in:IEEE microwave and wireless components letters 2003-01, Vol.13 (1), p.21-23
Hauptverfasser: Kamgaing, T., Ramahi, O.M.
Format: Artikel
Sprache:eng
Schlagworte:
Active noise reduction
Applied sciences
Capacitors
Circuit noise
Circuit properties
Electric, optical and optoelectronic circuits
Electronics
Exact sciences and technology
Joining processes
Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits
Photonic band gap
Radio frequency
Resonance
Semiconductor device noise
Surface impedance
Switches
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Beschreibung
Zusammenfassung:A novel technique for suppressing power plane resonance at microwave and radio frequencies is presented. The new concept consists of replacing one of the plates of a parallel power plane pair with a high impedance surface or electromagnetic band gap structure. The combination of this technique with a wall of RC pairs extends the lower edge of the effective bandwidth to dc, and allows resonant mode suppression up to the upper edge of the band-gap. The frequency range for noise mitigation is controlled by the geometry of the HIGP structure.
ISSN:1531-1309
2771-957X
1558-1764
2771-9588
DOI:10.1109/LMWC.2002.807713