A new fabrication process for planar thin-film multijunction thermal converters

A new fabrication process for planar thin-film multijunction thermal converters

Advanced thin-film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters (MJTCs). The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters and are optimize...

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Veröffentlicht in:IEEE transactions on instrumentation and measurement 2001-04, Vol.50 (2), p.330-332
Hauptverfasser: Wunsch, T.F., Kinard, J.R., Manginell, R.P., Solomon, O.M., Lipe, T.E., Jungling, K.C.
Format: Artikel
Sprache:eng
Schlagworte:
Bandwidth
Biomembranes
Construction
Converters
Design optimization
Dielectric thin films
Fabrication
Gold
Instrumentation
Manufacturability
NIST
Packaging
Silicon
Sputtering
Thin films
Transistors
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Beschreibung
Zusammenfassung:Advanced thin-film processing and packaging technologies are employed in the fabrication of new planar thin-film multijunction thermal converters (MJTCs). The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters and are optimized for improved sensitivity, bandwidth, manufacturability, and reliability.
ISSN:0018-9456
1557-9662
DOI:10.1109/19.918134