Terminally Chlorinated and Thiophene-linked Acceptor-Donor-Acceptor Structured 3D Acceptors with Versatile Processability for High-efficiency Organic Solar Cells

To exploit the potential of our newly developed three-dimensional (3D) dimerized acceptors, a series of chlorinated 3D acceptors (namely CH8-3/4/5) were reported by precisely tuning the position of chlorine (Cl) atom. The introduction of Cl atom in central unit affects the molecular conformation. Wh...

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Veröffentlicht in:Angewandte Chemie International Edition 2023-09, Vol.62 (38), p.e202307962-e202307962
Hauptverfasser: Chen, Hongbin, Kan, Bin, Wang, Peiran, Feng, Wanying, Li, Longyu, Zhang, Shuchao, Chen, Tianqi, Yang, Yang, Duan, Tainan, Yao, Zhaoyang, Li, Chenxi, Wan, Xiangjian, Chen, Yongsheng
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Sprache:eng
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Zusammenfassung:To exploit the potential of our newly developed three-dimensional (3D) dimerized acceptors, a series of chlorinated 3D acceptors (namely CH8-3/4/5) were reported by precisely tuning the position of chlorine (Cl) atom. The introduction of Cl atom in central unit affects the molecular conformation. Whereas, by replacing fluorinated terminal groups (CH8-3) with chlorinated terminal groups (CH8-4 and CH8-5), the red-shift absorption and enhanced crystallization are achieved. Benefiting from these, all devices received promising power conversion efficiencies (PCEs) over 16 % as well as decent thermal/photo-stabilities. Among them, PM6:CH8-4 based device yielded a best PCE of 17.58 %. Besides, the 3D merits with multi alkyl chains enable their versatile processability during the device preparation. Impressive PCEs of 17.27 % and 16.23 % could be achieved for non-halogen solvent processable devices prepared in glovebox and ambient, respectively. 2.88 cm modules also obtained PCEs over 13 % via spin-coating and blade-coating methods, respectively. These results are among the best performance of dimerized acceptors. The decent performance of CH8-4 on small-area devices, modules and non-halogen solvent-processed devices highlights the versatile processing capability of our 3D acceptors, as well as their potential applications in the future.
ISSN:1433-7851
1521-3773
DOI:10.1002/anie.202307962