THE INFLUENCE OF ANTIMONY, LEAD AND SULPHUR ON THE SURFACE TENSION OF LIQUID COPPER

In the present paper, the results of the study on the influence of antimony, lead and sulphur on the surface tension of liquid copper are presented. The measurements of the surface tension of liquid Cu-Sb alloys containing maximum 5.12x10(exp-2) mole fraction of Sb, liquid Cu-Pb alloys containing maximum 3.47x10(exp-2) mole fraction of Pb and liquid Cu-S alloys containing maximum 1.59x10(exp-2) mole fraction of S were made. The measurements were carried out by means of the sessile drop method, in the temperature range 1393-1553 K. The results of the experiment show that sulphur has the strongest influence on the decrease in the surface tension of copper. Weaker influence is shown by lead and antimony, consecutively.