Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad
Interface reactions between Sn–Zn lead-free solders and the Au/Ni electrolytic-plated Cu pad after isothermal aging were investigated. The intermetallic compounds at the interface between solder and the Au/Ni electrolytic-plated Cu pad were examined by field-emission scanning electron microscopy and...
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| Veröffentlicht in: | Journal of alloys and compounds 2004-10, Vol.379 (1-2), p.314-318 |
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| container_end_page | 318 |
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| container_issue | 1-2 |
| container_start_page | 314 |
| container_title | Journal of alloys and compounds |
| container_volume | 379 |
| creator | Kim, Kyung-Seob Yang, Jun-Mo Yu, Chong-Hee Jung, In-Ok Kim, Heon-Hee |
| description | Interface reactions between Sn–Zn lead-free solders and the Au/Ni electrolytic-plated Cu pad after isothermal aging were investigated. The intermetallic compounds at the interface between solder and the Au/Ni electrolytic-plated Cu pad were examined by field-emission scanning electron microscopy and transmission electron microscopy. During the reflow, Zn firstly reacted with Au and then was transformed to the β-AuZn (cubic phase, JCPDS 30-0608) compound in the bottom side of the solder. As aging time increased, γ-Ni5Zn21 (cubic phase, JCPDS 06-0653) compounds were formed on the Ni layer. Finally, the Ni5Zn21 phase divided by three layer was formed with grains of columnar shape, and the thickness of the layers was changed by aging time. |
| doi_str_mv | 10.1016/j.jallcom.2004.03.138 |
| format | Article |
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The intermetallic compounds at the interface between solder and the Au/Ni electrolytic-plated Cu pad were examined by field-emission scanning electron microscopy and transmission electron microscopy. During the reflow, Zn firstly reacted with Au and then was transformed to the β-AuZn (cubic phase, JCPDS 30-0608) compound in the bottom side of the solder. As aging time increased, γ-Ni5Zn21 (cubic phase, JCPDS 06-0653) compounds were formed on the Ni layer. Finally, the Ni5Zn21 phase divided by three layer was formed with grains of columnar shape, and the thickness of the layers was changed by aging time.</description><identifier>ISSN: 0925-8388</identifier><identifier>EISSN: 1873-4669</identifier><identifier>DOI: 10.1016/j.jallcom.2004.03.138</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Chip scale package ; Condensed matter: structure, mechanical and thermal properties ; Diffusion; interface formation ; Exact sciences and technology ; Intermetallic compound ; Lead-free ; Physics ; Sn–Zn ; Solid surfaces and solid-solid interfaces ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties) ; Thermal aging</subject><ispartof>Journal of alloys and compounds, 2004-10, Vol.379 (1-2), p.314-318</ispartof><rights>2004 Elsevier B.V.</rights><rights>2004 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c434t-2a3f2f8e0dd23b2888b61d357c4d1ffb6a19c9fe365d86bff427aaaa529727db3</citedby><cites>FETCH-LOGICAL-c434t-2a3f2f8e0dd23b2888b61d357c4d1ffb6a19c9fe365d86bff427aaaa529727db3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.jallcom.2004.03.138$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3548,27923,27924,45994</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=16108095$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Kim, Kyung-Seob</creatorcontrib><creatorcontrib>Yang, Jun-Mo</creatorcontrib><creatorcontrib>Yu, Chong-Hee</creatorcontrib><creatorcontrib>Jung, In-Ok</creatorcontrib><creatorcontrib>Kim, Heon-Hee</creatorcontrib><title>Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad</title><title>Journal of alloys and compounds</title><description>Interface reactions between Sn–Zn lead-free solders and the Au/Ni electrolytic-plated Cu pad after isothermal aging were investigated. The intermetallic compounds at the interface between solder and the Au/Ni electrolytic-plated Cu pad were examined by field-emission scanning electron microscopy and transmission electron microscopy. During the reflow, Zn firstly reacted with Au and then was transformed to the β-AuZn (cubic phase, JCPDS 30-0608) compound in the bottom side of the solder. As aging time increased, γ-Ni5Zn21 (cubic phase, JCPDS 06-0653) compounds were formed on the Ni layer. Finally, the Ni5Zn21 phase divided by three layer was formed with grains of columnar shape, and the thickness of the layers was changed by aging time.</description><subject>Chip scale package</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Diffusion; interface formation</subject><subject>Exact sciences and technology</subject><subject>Intermetallic compound</subject><subject>Lead-free</subject><subject>Physics</subject><subject>Sn–Zn</subject><subject>Solid surfaces and solid-solid interfaces</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><subject>Thermal aging</subject><issn>0925-8388</issn><issn>1873-4669</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2004</creationdate><recordtype>article</recordtype><recordid>eNqFkMtuFDEQRa2ISBkCn4DkDey640c_3Cs0GkFAisgC2LCxqu2y8MhjD7aHaHb5B_6QL0lHMxJLalObc-uqDiFvOGs548PNtt1CCCbtWsFY1zLZcqkuyIqrUTbdMEwvyIpNom-UVOqKvCxlyxjjk-QrMq8jhGPxhaZIfayYHRgPgWYEU32Khc5YHxAj_Rr_Pv75EWlJwWIuFKKl9SfS9eHmi6cY0NScwrF60-wDVLR0c6B7sK_IpYNQ8PV5X5PvHz9823xq7u5vP2_Wd43pZFcbAdIJp5BZK-QslFLzwK3sR9NZ7tw8AJ_M5FAOvVXD7FwnRlimF9MoRjvLa_LudHef068Dlqp3vhgMASKmQ9FCCTWyTi1gfwJNTqVkdHqf_Q7yUXOmn43qrT4b1c9GNZN6Mbrk3p4LoBgILkM0vvwLD5wpNvUL9_7E4fLtb49ZF-MxGrQ-L5K0Tf4_TU_OMpEl</recordid><startdate>20041006</startdate><enddate>20041006</enddate><creator>Kim, Kyung-Seob</creator><creator>Yang, Jun-Mo</creator><creator>Yu, Chong-Hee</creator><creator>Jung, In-Ok</creator><creator>Kim, Heon-Hee</creator><general>Elsevier B.V</general><general>Elsevier</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7TB</scope><scope>8BQ</scope><scope>8FD</scope><scope>FR3</scope><scope>H8D</scope><scope>JG9</scope><scope>KR7</scope><scope>L7M</scope></search><sort><creationdate>20041006</creationdate><title>Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad</title><author>Kim, Kyung-Seob ; Yang, Jun-Mo ; Yu, Chong-Hee ; Jung, In-Ok ; Kim, Heon-Hee</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c434t-2a3f2f8e0dd23b2888b61d357c4d1ffb6a19c9fe365d86bff427aaaa529727db3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2004</creationdate><topic>Chip scale package</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Diffusion; interface formation</topic><topic>Exact sciences and technology</topic><topic>Intermetallic compound</topic><topic>Lead-free</topic><topic>Physics</topic><topic>Sn–Zn</topic><topic>Solid surfaces and solid-solid interfaces</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><topic>Thermal aging</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kim, Kyung-Seob</creatorcontrib><creatorcontrib>Yang, Jun-Mo</creatorcontrib><creatorcontrib>Yu, Chong-Hee</creatorcontrib><creatorcontrib>Jung, In-Ok</creatorcontrib><creatorcontrib>Kim, Heon-Hee</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Materials Research Database</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of alloys and compounds</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kim, Kyung-Seob</au><au>Yang, Jun-Mo</au><au>Yu, Chong-Hee</au><au>Jung, In-Ok</au><au>Kim, Heon-Hee</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad</atitle><jtitle>Journal of alloys and compounds</jtitle><date>2004-10-06</date><risdate>2004</risdate><volume>379</volume><issue>1-2</issue><spage>314</spage><epage>318</epage><pages>314-318</pages><issn>0925-8388</issn><eissn>1873-4669</eissn><abstract>Interface reactions between Sn–Zn lead-free solders and the Au/Ni electrolytic-plated Cu pad after isothermal aging were investigated. The intermetallic compounds at the interface between solder and the Au/Ni electrolytic-plated Cu pad were examined by field-emission scanning electron microscopy and transmission electron microscopy. During the reflow, Zn firstly reacted with Au and then was transformed to the β-AuZn (cubic phase, JCPDS 30-0608) compound in the bottom side of the solder. As aging time increased, γ-Ni5Zn21 (cubic phase, JCPDS 06-0653) compounds were formed on the Ni layer. Finally, the Ni5Zn21 phase divided by three layer was formed with grains of columnar shape, and the thickness of the layers was changed by aging time.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/j.jallcom.2004.03.138</doi><tpages>5</tpages></addata></record> |
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| ispartof | Journal of alloys and compounds, 2004-10, Vol.379 (1-2), p.314-318 |
| issn | 0925-8388 1873-4669 |
| language | eng |
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| source | ScienceDirect Journals (5 years ago - present) |
| subjects | Chip scale package Condensed matter: structure, mechanical and thermal properties Diffusion interface formation Exact sciences and technology Intermetallic compound Lead-free Physics Sn–Zn Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thermal aging |
| title | Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad |
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