Analysis on interfacial reactions between Sn–Zn solders and the Au/Ni electrolytic-plated Cu pad

Interface reactions between Sn–Zn lead-free solders and the Au/Ni electrolytic-plated Cu pad after isothermal aging were investigated. The intermetallic compounds at the interface between solder and the Au/Ni electrolytic-plated Cu pad were examined by field-emission scanning electron microscopy and...

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Veröffentlicht in:	Journal of alloys and compounds 2004-10, Vol.379 (1-2), p.314-318
Hauptverfasser:	Kim, Kyung-Seob, Yang, Jun-Mo, Yu, Chong-Hee, Jung, In-Ok, Kim, Heon-Hee
Format:	Artikel
Sprache:	eng
Schlagworte:	Chip scale package Condensed matter: structure, mechanical and thermal properties Diffusion interface formation Exact sciences and technology Intermetallic compound Lead-free Physics Sn–Zn Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thermal aging
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Beschreibung
Zusammenfassung:	Interface reactions between Sn–Zn lead-free solders and the Au/Ni electrolytic-plated Cu pad after isothermal aging were investigated. The intermetallic compounds at the interface between solder and the Au/Ni electrolytic-plated Cu pad were examined by field-emission scanning electron microscopy and transmission electron microscopy. During the reflow, Zn firstly reacted with Au and then was transformed to the β-AuZn (cubic phase, JCPDS 30-0608) compound in the bottom side of the solder. As aging time increased, γ-Ni5Zn21 (cubic phase, JCPDS 06-0653) compounds were formed on the Ni layer. Finally, the Ni5Zn21 phase divided by three layer was formed with grains of columnar shape, and the thickness of the layers was changed by aging time.
ISSN:	0925-8388 1873-4669
DOI:	10.1016/j.jallcom.2004.03.138