Fiber-array pigtailing and packaging of an InP-based optical cross-connect chip

Fiber-array pigtailing and packaging of an InP-based optical cross-connect chip

A method of coupling six single-mode fiber tapers with 250-/spl mu/m spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient...

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Veröffentlicht in:IEEE journal of selected topics in quantum electronics 1999-09, Vol.5 (5), p.1255-1259
Hauptverfasser: van Zantvoort, J.H.C., Huijskens, F.M., Herben, G.P., de Waardt, H.
Format: Artikel
Sprache:eng
Schlagworte:
Optical coupling
Optical fiber polarization
Optical fiber testing
Optical fibers
Optical interferometry
Optical planar waveguides
Optical refraction
Optical variables control
Optical waveguides
Packaging
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Beschreibung
Zusammenfassung:A method of coupling six single-mode fiber tapers with 250-/spl mu/m spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient temperature range of 5/spl deg/C to 45/spl deg/C.
ISSN:1077-260X
1558-4542
DOI:10.1109/2944.806749