Dsc study of cure kinetics of dgeba-based epoxy resin with poly(oxypropylene) diamine

A kinetic study of cure kinetics of epoxy resin based on a diglycidyl ether of Bisphenol A (DGEBA), with poly(oxypropylene) diamine (Jeffamine D230) as a curing agent, was performed by means of differential scanning calorimetry (DSC). Isothermal and dynamic DSC characterizations of stoichiometric an...

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Veröffentlicht in:Journal of Thermal Analysis and Calorimetry 2005-07, Vol.81 (2), p.369-373
Hauptverfasser: MACAN, J, BRNARDIC, I, IVANKOVIC, M, MENCER, H. J
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Sprache:eng
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Zusammenfassung:A kinetic study of cure kinetics of epoxy resin based on a diglycidyl ether of Bisphenol A (DGEBA), with poly(oxypropylene) diamine (Jeffamine D230) as a curing agent, was performed by means of differential scanning calorimetry (DSC). Isothermal and dynamic DSC characterizations of stoichiometric and sub-stoichiometric mixtures were performed. The kinetics of cure was described successfully by empirical models in wide temperature range. System with sub-stoichiometric content of amine showed evidence of two separate reactions, second of which was presumed to be etherification reaction. Catalytic influence of hydroxyl groups formed by epoxy-amine addition was determined.
ISSN:1388-6150
1588-2926
0368-4466
DOI:10.1007/s10973-005-0794-3