CAPCAL-a 3-D capacitance solver for support of CAD systems

CAPCAL-a 3-D capacitance solver for support of CAD systems

A program package is presented named CAPCAL that provides a method for calculation of the 3-D electric field distribution due to multilayer metallization of advanced VLSI (very large-scale integration) integrated circuits. The underlying physics and numerical modeling techniques used by CAPCAL are d...

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Veröffentlicht in:IEEE transactions on computer-aided design of integrated circuits and systems 1988-05, Vol.7 (5), p.549-556
Hauptverfasser: Seidl, A., Klose, H., Svoboda, M., Oberndorfer, J., Rosner, W.
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Finite difference methods
Integrated circuit metallization
Integrated circuit packaging
Integrated circuits
Large scale integration
Nonhomogeneous media
Numerical models
Parasitic capacitance
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Very large scale integration
Wiring
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Beschreibung
Zusammenfassung:A program package is presented named CAPCAL that provides a method for calculation of the 3-D electric field distribution due to multilayer metallization of advanced VLSI (very large-scale integration) integrated circuits. The underlying physics and numerical modeling techniques used by CAPCAL are described. The finite-difference method together with a multigrid solver is used to permit easy program handling and full portability. Example capacitance calculations are presented for structures typical of the wiring of a memory cell. The influence of the line spacing and the permittivity of the passivation layer on the parasitic capacitances are also investigated. The codes developed have been tested on various computers down to the size of a microcomputer, and thus can be installed on every system currently in use for CAD.< >
ISSN:0278-0070
1937-4151
DOI:10.1109/43.3192