Understanding and Mitigating the Degradation of Perovskite Solar Cells Based on a Nickel Oxide Hole Transport Material during Damp Heat Testing

The development of stable materials, processable on a large area, is a prerequisite for perovskite industrialization. Beyond the perovskite absorber itself, this should also guide the development of all other layers in the solar cell. In this regard, the use of NiO x as a hole transport material (HT...

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Veröffentlicht in:ACS applied materials & interfaces 2023-06, Vol.15 (23), p.27941-27951
Hauptverfasser: Dussouillez, Marion, Moon, Soo-Jin, Mensi, Mounir, Wolff, Christian M., Liu, Yongpeng, Yum, Jun-Ho, Kamino, Brett A., Walter, Arnaud, Sahli, Florent, Lauber, Ludovic, Christmann, Gabriel, Sivula, Kevin, Jeangros, Quentin, Ballif, Christophe, Nicolay, Sylvain, Paracchino, Adriana
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Sprache:eng
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Zusammenfassung:The development of stable materials, processable on a large area, is a prerequisite for perovskite industrialization. Beyond the perovskite absorber itself, this should also guide the development of all other layers in the solar cell. In this regard, the use of NiO x as a hole transport material (HTM) offers several advantages, as it can be deposited with high throughput on large areas and on flat or textured surfaces via sputtering, a well-established industrial method. However, NiO x may trigger the degradation of perovskite solar cells (PSCs) when exposed to environmental stressors. Already after 100 h of damp heat stressing, a strong fill factor (FF) loss appears in conjunction with a characteristic S-shaped J–V curve. By performing a wide range of analysis on cells and materials, completed by device simulation, the cause of the degradation is pinpointed and mitigation strategies are proposed. When NiO x is heated in an air-tight environment, its free charge carrier density drops, resulting in a band misalignment at the NiO x /perovskite interface and in the formation of a barrier impeding hole extraction. Adding an organic layer between the NiO x and the perovskite enables higher performances but not long-term thermal stability, for which reducing the NiO x thickness is necessary.
ISSN:1944-8244
1944-8252
DOI:10.1021/acsami.3c02709