Development of Ultra Thin Quartz by Abrasive Machining

The conventional lapping and polishing techniques are typically applied to fabricate ultra-thin quartz oscillators up to 5 *mm in thickness. New ring-like protective electro-plating films were developed to achieve a uniform polishing pressure distribution, and as such to reduce the formation of dull...

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Veröffentlicht in:Key engineering materials 2004-01, Vol.257-258, p.123-128
Hauptverfasser: Watanabe, Junji, Ohbuchi, Y., Touge, Mutsumi, Ueda, N., Sakamoto, Hidetoshi
Format: Artikel
Sprache:eng
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Zusammenfassung:The conventional lapping and polishing techniques are typically applied to fabricate ultra-thin quartz oscillators up to 5 *mm in thickness. New ring-like protective electro-plating films were developed to achieve a uniform polishing pressure distribution, and as such to reduce the formation of dull edges around thin substrates. Having improved the optical contact method for fixing the substrates, ultra-thin quartz substrates of 4.9 *mm in thickness and 5.2 mm in diameter were finally obtained with good flatness and surface roughness.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.257-258.123