Development of Ultra Thin Quartz by Abrasive Machining
The conventional lapping and polishing techniques are typically applied to fabricate ultra-thin quartz oscillators up to 5 *mm in thickness. New ring-like protective electro-plating films were developed to achieve a uniform polishing pressure distribution, and as such to reduce the formation of dull...
Gespeichert in:
Veröffentlicht in: | Key engineering materials 2004-01, Vol.257-258, p.123-128 |
---|---|
Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The conventional lapping and polishing techniques are typically applied to fabricate ultra-thin quartz oscillators up to 5 *mm in thickness. New ring-like protective electro-plating films were developed to achieve a uniform polishing pressure distribution, and as such to reduce the formation of dull edges around thin substrates. Having improved the optical contact method for fixing the substrates, ultra-thin quartz substrates of 4.9 *mm in thickness and 5.2 mm in diameter were finally obtained with good flatness and surface roughness. |
---|---|
ISSN: | 1013-9826 1662-9795 1662-9795 |
DOI: | 10.4028/www.scientific.net/KEM.257-258.123 |