A comparison of the strength of multilayers, thin films and nanocrystalline compacts

A survey of the yield strength and hardness of copper-based materials shows a progressive lowering of the strength with respect to the extrapolation of the Hall–Petch relation as the length scale of the microstructure decreases. The overall trend can be modeled by scaling the elastic screening lengt...

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Veröffentlicht in:Scripta materialia 2004-03, Vol.50 (6), p.729-732
Hauptverfasser: Spaepen, F., Yu, D.Y.W.
Format: Artikel
Sprache:eng
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Zusammenfassung:A survey of the yield strength and hardness of copper-based materials shows a progressive lowering of the strength with respect to the extrapolation of the Hall–Petch relation as the length scale of the microstructure decreases. The overall trend can be modeled by scaling the elastic screening length for the dislocation line tension with the microstructural length scale, as proposed by Scattergood and Koch.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2003.11.038