Static analysis of the die picking process

A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to s...

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Veröffentlicht in:	IEEE transactions on electronics packaging manufacturing 2005-04, Vol.28 (2), p.142-149
Hauptverfasser:	LIN, Yeong-Jyh, HWANG, Sheng-Jye
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Bonding Breakage Die bonder Ejection Electronics Exact sciences and technology Finite element methods finite-element method Gallium arsenide Manufacturing processes Mathematical models Microassembly Microelectronic fabrication (materials and surfaces technology) MMICs Needles Picking pickup process Pressing Production Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Surface cracks Taguchi method Tuning
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Beschreibung
Zusammenfassung:	A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.
ISSN:	1521-334X 1558-0822
DOI:	10.1109/TEPM.2005.847396