Wafer-scale profile evolution of electrochemically deposited copper films

Wafer-scale profile evolution of electrochemically deposited copper films

Wafer-scale profile evolution of electrochemically deposited copper films is experimentally studied and compared with theoretical predictions. The effects of ohmic potential drop, electrochemical current-voltage behavior at the metal/electrolyte interface, and local concentration variations are cons...

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Veröffentlicht in:Journal of the Electrochemical Society 2003-04, Vol.150 (4), p.C195-C201
Hauptverfasser: FLAKE, John, SOLOMENTSEV, Yuri, COOPER, Jennifer, COOPER, Kevin
Format: Artikel
Sprache:eng
Schlagworte:
Cross-disciplinary physics: materials science
rheology
Electrodeposition, electroplating
Exact sciences and technology
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Physics
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Zusammenfassung:Wafer-scale profile evolution of electrochemically deposited copper films is experimentally studied and compared with theoretical predictions. The effects of ohmic potential drop, electrochemical current-voltage behavior at the metal/electrolyte interface, and local concentration variations are considered. Results show good agreement with experimental data over a wide range of total currents and times.
ISSN:0013-4651
1945-7111
DOI:10.1149/1.1554723