Characterisation and Optimisation of Innovative Solders for Transient Liquid Phase Bonding and Active Soldering

Hybrid microstructures, able to combine the different properties of metallic and ceramic materials, are a source of growing interest in the field of microsystem engineering. Besides the construction technique, the joining technique plays a crucial role within this framework. Two innovative bonding technologies have been investigated: Transient Liquid Phase (TLP) Bonding and Active Soldering. New solders have been developed, evaluated and characterized with regard to fundamental parameters for the microstructures.