Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]

Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]

Part (c) of Fig. 6 was inadvertently deleted from the final paper and is reproduced here. The on-line version of the paper has been revised.

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Veröffentlicht in:Journal of electronic packaging 2006-03, Vol.128 (1), p.98-98
Hauptverfasser: Ahmad, Mudasir, Hubbard, Ken, Hu, Mason
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
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Zusammenfassung:Part (c) of Fig. 6 was inadvertently deleted from the final paper and is reproduced here. The on-line version of the paper has been revised.
ISSN:1043-7398
1528-9044
DOI:10.1115/1.2165648