Tungsten/copper composite deposits produced by a cold spray

An agglomerated tungsten/copper composite powder was both cold sprayed and plasma sprayed onto a mild steel substrate for electronic package applications. Most pores resulting from the spraying were found in the vicinity of the tungsten-rich regions of the final product. The levels of porosity varied with the amount of tungsten present. No copper oxidation was found at the cold-sprayed deposit, but relatively high copper oxidation was observed at the plasma-sprayed deposit.