Liquid‐Superspreading‐Boosted High‐Performance Jet‐Flow Boiling for Enhancement of Phase‐Change Cooling

Enhanced boiling heat transfer via surface engineering is a topic of general interest for its great demand in industrial fields. However, as a dynamic interfacial phenomenon, a deep understanding of its process and mechanism, including liquid re‐wetting and vapor departure, is still challenging. Herein, a micro‐/nanostructured Cu surface containing a periodic microgroove/pyramid array with rich nanowrinkles is designed, where superspreading (