Thermal Oxidation Study on Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

Thermal Oxidation Study on Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Advanced engineering materials 2006-02, Vol.8 (1-2), p.111-114
Hauptverfasser: Wan Cho, S., Han, K., Yi, Y., Kang, S. J., Yoo, K.-H., Jeong, K., Whang, C.-N.
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Corrosion
Corrosion mechanisms
Electronic packaging
Exact sciences and technology
Lead-free solders
Metals. Metallurgy
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:At present, the electronic packaging industry is actively searching for lead‐free (Pb‐free) solders due to environmental concerns over Pb‐containing solders. For a successful transition to Pb‐free manufacturing in electronics assembly, it is critical to understand the behavior of Pb‐free solders. We report the surface oxidation mechanism of Pb‐free solder in this paper. This mechanism has been investigated after using X‐ray photoelectron spectroscopy.
ISSN:1438-1656
1527-2648
DOI:10.1002/adem.200500188