Study of Semiconductor Film Bonding Technology on Piezoelectric Substrate Using Water Glass

Authors report a basic study on film bonding technology for realizing the acousto-optoelectronic integrated circuit, in which semiconductor optoelectronic devices and acousto optic devices are integrated on the piezoeletric substrate. Authors propose the novel film bonding technology using water glass as an adhesive material, and investigate optimum process conditions of concentration and treatment temperature of the water glass. The bonding strength between the GaAs film and piezoeletric substrate using water glass of 50 nm thickness is 4 times more than that without water glass. The stress distribution in the GaAs film with water glass is improved. Authors also fabricated a simple test device consisting of an acousto optic Bragg cell and photodiode array on the LiNbO3 substrate. 16 refs.