PVD grown (Ti,Si,Al)N nanocomposite coatings and (Ti,Al)N/(Ti,Si)N multilayers: structural and mechanical properties

In the last few years a considerable effort has been undertaken in order to optimise the production techniques of thin films and improve their quality. In this work, nanocomposite films resulting from Si additions to a (Ti,Al)N matrix have been prepared by RF and/or DC magnetron sputtering, with deposition rates varying from 0.21 μm/h to 4.6 μm/h. Rutherford Backscattering (RBS) and Electron Microprobe Analysis (EMPA) were used in order to access the chemical composition as well as the density of the films. For samples prepared with low deposition rates (deposited by a combination of RF and DC reactive magnetron sputtering) both symmetric and asymmetric XRD scans showed the development of crystalline phases whose structure is very similar to that of bulk TiN. The peak positions revealed changes of the lattice parameter from 0.420 to 0.428 nm with an increase of Si content dependent on the deposition rate. The lowest lattice parameter corresponds to a Ti–Si–Al–N phase where some of the Si and Al atoms are occupying Ti positions in the f.c.c. TiN lattice, while the highest lattice parameter corresponds to a system where at least a partial Si segregation can be enough to nucleate and develop the Si 3N 4 phase that forms a layer on the growth surface, covering the (Ti,Al)N nanocrystallites and limiting their growth. As for the (Ti,Al,Si)N crystalline texture evolution, a (111) preferential growth for (Ti,Al)N and for low Si content was observed, while at intermediate Si content the texture changed to (200). With the increase of the Si content there is a corresponding decrease in the size of the diffracting grains. For samples prepared with high deposition rates (DC sputtered samples) High-Resolution Transmission Electron Microscopy (HRTEM) micrographs revealed a columnar growth associated with the f.c.c.-type structure of both phases. Small crystallites with sizes between ±7 and ±10 nm were observed. The use of (Ti,Al) and (Ti,Si) targets, relatively high deposition rates and an alternate deposition resulted in a multilayer of (Ti,Si)N/(Ti,Al)N. This system was produced with modulation periods between 5 and 10 nm, as shown by HR-TEM results, when the samples were grown with a deposition rate between 2 and 4.6 μm/h, respectively. Their average ultramicrohardness can be as high as 50 GPa. The residual stress values for the multilayer system are significantly lower than that of (Ti,Si,Al)N nanocomposite coatings.