Heteroepitaxial growth of tungsten oxide films on silicon(100) using a BaF2 buffer layer
Multidomained heteroepitaxial WO3 films were grown on Si(100) substrates using a (111)-oriented BaF2 buffer layer at the WO3–Si interface. The 30-nm-thick BaF2 layer, grown by very low rate molecular-beam epitaxy, consisted of four equivalent crystalline domains oriented about the BaF2[111] axis, wh...
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Veröffentlicht in: | Journal of materials research 2003-12, Vol.18 (12), p.2859-2868 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Multidomained heteroepitaxial WO3 films were grown on Si(100) substrates using a (111)-oriented BaF2 buffer layer at the WO3–Si interface. The 30-nm-thick BaF2 layer, grown by very low rate molecular-beam epitaxy, consisted of four equivalent crystalline domains oriented about the BaF2[111] axis, which provided templates for heteroepitaxial WO3 film growth. The WO3 films were grown by electron cyclotron resonance oxygen plasma-assisted electron beam evaporation of a WO3 source, and the temperature range was varied between 25°C and 600°C. At an optimal deposition temperature of approximately 450°C, monoclinic-phase WO3 films were produced, which consisted of coexisting (002), (020), and (200) in-plane orientations with respect to the BaF2(111)/Si(100) substrate. During growth, an interfacial barium tungstate (BaWO4) reaction product formed at the WO3–BaF2 interface. The {112} planes of this BaWO4 layer also have a multidomained heteroepitaxial orientation with respect to the BaF2(111) buffer layer. Postdeposition annealing experiments in air for 24 h at 400°C indicated that the heteroepitaxial BaWO4 and WO3 layers remain stable. A thermodynamic argument is used to explain the BaWO4 interfacial reaction during initial growth stages, and kinetically limited diffusion processes through the BaWO4layer coupled with lattice matching across the WO3–BaWO4 interface are proposed to be responsible for the formation of stable WO3 films at later growth stages. |
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ISSN: | 0884-2914 2044-5326 |
DOI: | 10.1557/JMR.2003.0399 |